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Aktueller Firmenfall über Resin & Filament 3D-Printing Hardware — SLA Build Plates, Vat Frames, FEP Clips & FDM Nozzles
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Resin & Filament 3D-Printing Hardware — SLA Build Plates, Vat Frames, FEP Clips & FDM Nozzles

2026-09-28
Falldetails

Challenge: An additive-manufacturing service removed uncured resin, support scrapings and factory grease from SLA/DLP build plates, resin vat frames, NFEP/FEP clip sets and LCD channels, plus burnt PLA/PETG/carbon deposits from FDM brass/nozzle hardware and extruder gears. Thermal cleaning could pre-cure resin, distort FEP clips, soften aluminum plates and alter nozzle heat-break tolerances.

Solution: ACMESONIC Ultrasonic Cleaner, SUS304/SUS316L, no heater. 28 kHz for burnt filament on nozzle exteriors and drive-gear grease, 40 kHz for SLA build plates and vat frames, 68 kHz for nozzle orifices and FEP clip grooves, degas mode for approved fresh solution, semi mode for anodized plates, NFEP frames and small nozzles. Plates and nozzles racked vertically, vats in partitioned trays.

Outcome: Build-plate texture and vat seams de-resined; FDM nozzle orifices and heat-break threads de-burnt without thermal tolerance change; fewer first-layer adhesion rejects after plate reconditioning.

28/40/68 kHz · SUS304/316L · vertical plate/nozzle racks + vat trays · degas + semi · approved agents, ambient, no heater